JPS634328B2 - - Google Patents
Info
- Publication number
- JPS634328B2 JPS634328B2 JP55021101A JP2110180A JPS634328B2 JP S634328 B2 JPS634328 B2 JP S634328B2 JP 55021101 A JP55021101 A JP 55021101A JP 2110180 A JP2110180 A JP 2110180A JP S634328 B2 JPS634328 B2 JP S634328B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- ceramic
- electrode
- layer
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 239000010419 fine particle Substances 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000002003 electrode paste Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 101150003085 Pdcl gene Proteins 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 229910017937 Ag-Ni Inorganic materials 0.000 description 1
- 229910017984 Ag—Ni Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- HIRWGWMTAVZIPF-UHFFFAOYSA-N nickel;sulfuric acid Chemical compound [Ni].OS(O)(=O)=O HIRWGWMTAVZIPF-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2110180A JPS56118323A (en) | 1980-02-21 | 1980-02-21 | Method of manufacturing ceramic electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2110180A JPS56118323A (en) | 1980-02-21 | 1980-02-21 | Method of manufacturing ceramic electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56118323A JPS56118323A (en) | 1981-09-17 |
| JPS634328B2 true JPS634328B2 (en]) | 1988-01-28 |
Family
ID=12045472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2110180A Granted JPS56118323A (en) | 1980-02-21 | 1980-02-21 | Method of manufacturing ceramic electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56118323A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60142503A (ja) * | 1983-12-28 | 1985-07-27 | ティーディーケイ株式会社 | バリスタ |
| JPS62230005A (ja) * | 1986-03-31 | 1987-10-08 | 株式会社デンソー | 正特性磁器半導体 |
| JP2555317B2 (ja) * | 1986-02-27 | 1996-11-20 | 日本電装株式会社 | 正特性磁器半導体の製造方法 |
-
1980
- 1980-02-21 JP JP2110180A patent/JPS56118323A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56118323A (en) | 1981-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH10284343A (ja) | チップ型電子部品 | |
| JP7431798B2 (ja) | バリスタパッシベーション層及びその製造方法 | |
| JP4083971B2 (ja) | 積層セラミック電子部品及びその製造方法 | |
| JP7724470B2 (ja) | バリスタ及びその製造方法 | |
| KR100203728B1 (ko) | 박막 캐패시터 | |
| JPS634327B2 (en]) | ||
| JPS634328B2 (en]) | ||
| JP3544569B2 (ja) | 積層セラミックコンデンサ | |
| JPS634332B2 (en]) | ||
| JP2618019B2 (ja) | メッキ下地用導電性塗料およびそれを用いるメッキ方法 | |
| JP2996016B2 (ja) | チップ型電子部品の外部電極 | |
| JPS629204B2 (en]) | ||
| JPS634329B2 (en]) | ||
| JPS62122103A (ja) | 積層型チツプバリスタの製造方法 | |
| JPS634330B2 (en]) | ||
| JPH0133929B2 (en]) | ||
| JP2996015B2 (ja) | チップ型電子部品の外部電極 | |
| JP2000306763A (ja) | 積層セラミックコンデンサとその製造方法 | |
| JP3580391B2 (ja) | 導電性チップ型セラミック素子の製造方法 | |
| JPS634336B2 (en]) | ||
| JPS634338B2 (en]) | ||
| JP2574383B2 (ja) | セラミック電子部品の電極形成方法 | |
| JP2013168526A (ja) | 積層型電子部品及びその製造方法 | |
| JPS5858717A (ja) | 電子部品 | |
| JPS634331B2 (en]) |